Double-Sided PCB Design & Prototype

The objective of this project is to design a double-sided printed circuit board (PCB) that provides an efficient and reliable solution for complex electronic systems requiring higher component density and reduced board size. This project involves creating a comprehensive PCB layout with components placed on both the top and bottom layers, ensuring optimal routing and electrical performance. Key features of the project include: Component Placement: Efficient placement of components on both sides of the PCB to optimize space and minimize the board's footprint, while considering factors like heat dissipation, signal integrity, and ease of manufacturing. Signal Routing: Careful routing of electrical connections between components across both sides of the board, using vias to interconnect the layers. Signal traces will be routed to reduce interference, crosstalk, and ensure high-speed signal transmission. Layer Stack-up: Define the number and type of layers used for the PCB. For a double-sided board, this typically includes the top layer, bottom layer, and a ground plane or power plane if needed. The stack-up design is critical for ensuring signal integrity and minimizing electromagnetic interference (EMI). Design for Manufacturability (DFM): Ensure that the PCB design meets manufacturing requirements, such as trace width, via sizes, and component placement rules, to facilitate cost-effective production and assembly. Electrical Analysis: Conduct simulations and electrical checks for power integrity, signal integrity, and thermal management to avoid issues like signal degradation or excessive heat build-up. Compliance: The design will adhere to industry standards and regulations, ensuring compatibility with industry-standard components and compliance with electromagnetic compatibility (EMC) and safety standards. The PCB will be used in industrial machinery applications. The PCB design should be created using Altium Designer. The expected timeline for the project is 2-4 weeks.